Home | 中文 English
  • Home
  • About Us
  • Products
  • News
  • Success Cases
  • Services
  • Contact Us
  • SiC Substrate Wafer
  • Dummy SiC Wafer
  • Research SiC Wafer
  • Production SiC Wafer
  • Ultralow MPD SiC Wafer
  • GaN Epitaxial Wafer
  • SiC As-cut Wafer
  • SiC Boule/Ingots
  • GaN Substrate Wafer
  • Free-Standing GaN
  • GaN-On-Sapphire Template
  • SiC Epitaxial Wafer
Home > Products > SiC Substrate Wafer > Production SiC Wafer > 4''HPSI-SiC Wafer (4H-SI) P Grade

4''HPSI-SiC Wafer (4H-SI) P Grade

Type: Semi-insulating
Diameter:100mm
Grade:  Production
Application: GaN Epi

Product Description

HMT's 4 inch High-Purity Semi-Insulating (HPSI) Silicon Carbide (4H-SiC) Wafer, P-Grade, is a premier substrate engineered for high-frequency, high-power, and high-temperature semiconductor applications. Fabricated with the superior 4H polytype, this wafer offers an exceptional combination of thermal conductivity, electrical stability, and mechanical robustness.

The P-Grade designation ensures a stringent level of quality control, providing excellent crystalline perfection, low defect density, and outstanding semi-insulating properties, characterized by very high electrical resistivity. This makes it the ideal foundation for manufacturing next-generation radio frequency (RF) devices, such as GaN-on-SiC HEMTs, as well as demanding sensors and optoelectronic components. Empower your most advanced designs with a substrate that delivers unparalleled performance and reliability.

4H-SI SiC Wafer Key Features

  1. High-Purity Semi-Insulating (HPSI) Property: Exhibits extremely high electrical resistivity (> 1E7 ohm·cm), minimizing parasitic capacitance and signal loss for superior high-frequency performance.

  2. Superior Thermal Management: Features excellent thermal conductivity (≥ 490 W/m·K), enabling efficient heat dissipation from high-power devices, enhancing reliability and longevity.

  3. Exceptional Crystalline Quality (P-Grade): Guarantees low micropipe density (MPD<0.2cm-2) and controlled dislocation density, ensuring high device yield and consistent performance.

  4. Advanced Surface Finish: Offers epitaxy-ready polished surfaces with low surface roughness, providing an ideal foundation for high-quality thin-film epitaxial growth.

  5. Robust Mechanical Material: Possesses high mechanical strength and chemical inertness, allowing for stable processing in demanding fabrication environments.

Related Products

  • 6 inch N Type 4H-SiC Wafer Supplier

  • SiC Wafer Manufacturer

  • Home
  • About Us
  • Products
  • News
  • Success Cases
  • Services
  • Contact Us

Homray Material Technology. All rights Reserved.
E-mail:kim@homray-material.com;tina@homray-material.com

M.P: +86-15366208370 ; +86-15366203573